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IEC 61249-8-7:1996

Current
Current

The latest, up-to-date edition.

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

26-04-1996

FOREWORD
Clause
1 Scope
2 Normative references
3 Requirements
   3.1 Storage properties
   3.2 Containers and their markings
   3.3 Adhesion (pressure sensitive tape method)
   3.4 Resistance to solvents, fluxes and soldering
   3.5 Degree of cure
   3.6 Abrasion resistance (pencil hardness)
   3.7 Flammability
   3.8 Thermal shock
   3.9 Solderability
   3.10 Environmental
Annexes
A Conversion table
B Bibliography

Details requirements for the qualification of marking inks used forlegends and other identifications used on printed boards.Information in this specification will also provide guidanceregarding the suitability of printed boards which feature markinginks.

DevelopmentNote
Also numbered as BS EN 61249-8.7 (11/2005) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
27
PublisherName
International Electrotechnical Committee
Status
Current

BS EN 62326-4:1997 Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat

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