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IEC 61760-2:2007

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

16-07-2021

Language(s)

English, English - French

Published date

24-04-2007

Publisher

International Electrotechnical Committee

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

Committee
TC 91
DevelopmentNote
Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
9
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
09/30186180 DC : 0 BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 61760-4 : 2016 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
OVE/ONORM EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
BS EN 61760-3:2010 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
NF EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
EN 61760-4:2015/A1:2018 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
UTEC 90 720-1 : 2000 ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
BS EN 61760-4 : 2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
12/30261600 DC : DRAFT MAR 2012 BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General

IEC TS 61340-5-2:1999 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
IEC 60721-3-2:1997 Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 2: Transportation
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60721-3-1:1997 Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage

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Hardcopy - English
PDF - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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