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IEC
IEC 62047-11:2013

IEC 62047-11:2013

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

17-07-2013

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative References
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Test piece fabrication
Annex B (informative) - Test piece handling example
Annex C (informative) - Test piece releasing process
Annex D (informative) - Out-of-plane test setup and
        test piece example
Annex E (informative) - Data analysis example in
        in-plane test method
Annex F (informative) - Data analysis example in
        out-of-plane test method
Bibliography

IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material's melting temperature.

DevelopmentNote
Stability Date: 2018. (11/2017)
DocumentType
Standard
Pages
38
PublisherName
International Electrotechnical Committee
Status
Current

ASTM E 228 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
ASTM E 289 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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