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IEC
IEC 62047-22:2014

IEC 62047-22:2014

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

19-06-2014

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report

IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.

Committee
TC 47/SC 47F
DevelopmentNote
Stability date: 2017. (06/2014)
DocumentType
Standard
Pages
20
PublisherName
International Electrotechnical Committee
Status
Current

17/30352696 DC : DRAFT SEP 2017 BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS
IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
15/30319018 DC : 0 BS EN 62951-1 ED 1.0 - SEMICONDUCTOR DEVICES - FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES - PART 1: BENDING TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
ISO 527-3:1995 Plastics Determination of tensile properties Part 3: Test conditions for films and sheets

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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