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IEC
IEC 62047-6:2009

IEC 62047-6:2009

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

07-04-2009

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test piece
  4.1 Design of test piece
  4.2 Preparation of test piece
  4.3 Test piece thickness
  4.4 Storage prior to testing
5 Testing method and test apparatus
  5.1 General
  5.2 Method of gripping (mounting of test piece)
  5.3 Static loading test
  5.4 Method of loading
  5.5 Speed of testing
  5.6 Environment control
6 Endurances (test termination)
7 Test report
Annex A (informative) Technical background of this standard
Annex B (informative) Test piece
Annex C (informative) Displacement measurement
Annex D (informative) Testing environment
Annex E (informative) Number of test pieces
Bibliography

IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

DevelopmentNote
Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
30
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
JIS C 5630-6:2011 Identical
NEN EN IEC 62047-6 : 2010 Identical
DIN EN 62047-6:2010-07 Identical
EN 62047-6:2010 Identical
PN EN 62047-6 : 2010 Identical
NF EN 62047-6 : 2010 Identical
CEI EN 62047-6 : 2011 Identical
BS EN 62047-6:2010 Identical
I.S. EN 62047-6:2010 Identical
UNE-EN 62047-6:2010 Identical

EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
11/30230316 DC : 0 BS EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
CEI EN 62047-18 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
I.S. EN 62047-18:2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013 (EQV))
NF EN 62047-18 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

ASTM E 466 : 2015 : REDLINE Standard Practice for Conducting Force Controlled Constant Amplitude Axial Fatigue Tests of Metallic Materials
ISO 6892:1998 Metallic materials Tensile testing at ambient temperature
IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
ISO 1099:2017 Metallic materials — Fatigue testing — Axial force-controlled method
ISO 12107:2012 Metallic materials — Fatigue testing — Statistical planning and analysis of data

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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