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IEC 62374-1:2010

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

29-09-2010

FOREWORD
1 Scope
2 Terms and definitions
3 Test equipment
4 Test samples
5 Procedures
6 Lifetime estimation
7 Lifetime dependence on inter-metal layer area
8 Summary
Annex A (informative) - Engineering supplementation
        for lifetime estimation
Bibliography

IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

Committee
TC 47
DevelopmentNote
Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
36
PublisherName
International Electrotechnical Committee
Status
Current

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