Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

25-09-2013

Publisher

International Electrotechnical Committee

1 Scope
2 Terms and definitions
3 Test method for measuring tin whisker
  growth
4 Acceptance procedure for tin and tin alloy
  surface finishes
5 Acceptance criteria
6 Reporting of results
7 On-going tin whisker evaluation
Annex A (normative) - Test method for measuring
        whisker growth on tin and tin alloy
        surface finishes of semiconductor devices
Bibliography

IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) The content of IEC/PAS 62483 was added to the content of JESD201A as Annex A.
b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers.
c) A Clause 6 was introduced detailing the reporting requirements of test results.

Committee	TC 47
DevelopmentNote	Supersedes IEC PAS 62483. Stability date: 2021. (09/2017)
DocumentType	Standard
Pages	96
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC PAS 62483:2006

Standards	Relationship
BS IEC 62483:2013	Identical
NF EN 62483 : 2012 PR	Identical

EN 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
16/30344800 DC : 0	BS EN 60749-3 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
IEC TS 62686-1:2015	Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
CEI EN 60749-3 : 2004	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
BS EN 60749-3:2017	Semiconductor devices. Mechanical and climatic test methods External visual examination
I.S. EN 60749-3:2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
IEC 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
PD IEC/TS 62686-1:2015	Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors

IPC JP002 : 0

JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE

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IEC 62483:2013

Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

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