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IEC 62739-1:2013

Current
Current

The latest, up-to-date edition.

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

18-06-2013

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Method of erosion depth measurement
  (focal depth method with optical microscope)
6 Items to be recorded in test report
Annex A (normative) - Specifications of test
        equipment & measurement equipment
Annex B (informative) - Method of estimation of
        maximum erosion depth by extreme
        value statistical analysis
Bibliography

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

DevelopmentNote
Stability date: 2018. (06/2013)
DocumentType
Standard
Pages
36
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NF EN 62739-1 : 2014 Identical
NEN EN IEC 62739-1 : 2013 Identical
PN EN 62739-1 : 2013 Identical
BS EN 62739-1:2013 Identical
CEI EN 62739-1 : 2014 Identical
EN 62739-1 : 2013 Identical
DIN EN 62739-1:2014-02 Identical
UNE-EN 62739-1:2013 Identical
JIS C 62739-1:2015 Identical

EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
BS EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
I.S. EN 62739-2:2016 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
CEI EN 62739-3 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
16/30338642 DC : 0 BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD
EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-3:2014 Stainless steels for general purposes Part 3: Wire
ISO 16143-2:2014 Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014 Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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