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IEC 62739-3:2017

Current
Current

The latest, up-to-date edition.

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

06-01-2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Selection of the appropriate erosion test method
6 Common items for each test method
7 Overview of the test methods
Annex A (informative) - Selection of test
        temperature, test duration and bending stress
Annex B (informative) - Maximum depth and other
        measurements
Annex C (informative) - Erosion mechanism
Annex D (informative) - Thermal acceleration for
        erosion
Bibliography

IEC 62739-3:2017 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Committee
TC 91
DevelopmentNote
Stability Date: 2022. (01/2017)
DocumentType
Standard
Pages
32
PublisherName
International Electrotechnical Committee
Status
Current

IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-3:2014 Stainless steels for general purposes Part 3: Wire
ISO 16143-2:2014 Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014 Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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