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IEC PAS 62250:2001

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English

Published date

22-05-2001

1 SCOPE
  1.1 Scope
  1.2 Purpose
  1.3 Performance Classification and Type
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Joint Industry Standards
  2.3 Federal
  2.4 Other Publications
3 REQUIREMENTS
  3.1 General
  3.2 Materials Used in this Specification
  3.3 Visual Examination
  3.4 Board Dimensional Requirements
  3.5 Conductor Definition
  3.6 Structural Integrity
  3.7 Other Tests
  3.8 Solder Resist (Solder Mask) Requirements
  3.9 Electrical Requirements
  3.10 Cleanliness
  3.11 Special Requirements
  3.12 Repair
  3.13 Rework
4 QUALITY ASSURANCE PROVISIONS
  4.1 General
  4.2 Acceptance Tests
  4.3 Quality Conformance Testing
5 NOTES
  5.1 Ordering Data
  5.2 Superseded Specifications
APPENDIX A

Covers qualification and performance requirements of rigid printed boards which may be single-sided, double-sided, with or without plated-through holes, multilayer with plated-through holes, multilayer with or without buried/blind vias, and metal core boards.

DocumentType
Miscellaneous Product
Pages
36
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
IPC 6012 : C Identical
NEN NPR IEC/PAS 62250 : 2001 Identical

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 7721 : 1998 REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC AI 642 : 1988 USER'S GUIDELINES FOR AUTOMATED INSPECTION OF ARTWORK, INTERLAYERS AND UNPOPULATED PWBS
IPC CF 148 : A1998 RESIN COATED METAL FOR PRINTED BOARDS
IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC FC 232 : C1994 AMD 1 1995 ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
NEMA LI 1 : 1998(R2011) INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
IPC ET 652 : 1990 GUIDELINES AND REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC 6015 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
QQ-N-290 Revision A:1971 NICKEL PLATING (ELECTRODEPOSITED)
QQ-S-635 Revision B:1976 STEEL PLATE, CARBON

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