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IEC TS 61945:2000

Current
Current

The latest, up-to-date edition.

Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

10-03-2000

FOREWORD
Clause
1 Scope and object
2 Normative references
3 Terms
4 Classification of technology analysis
   4.1 First level: General visual inspection
        (AT1 test)
   4.2 Second level: Detailed visual inspection
        (AT2 test)
   4.3 Third level: Scanning electron microscope
        examination under large magnification
        (AT3 test)
   4.4 Fourth level: Construction analysis (AT4
        test)
   4.5 Fifth level: Complementary tests (AT5 test)
5 Failure analysis (AT6 test)
   5.1 Objective
   5.2 Resources
   5.3 Description

Gives the methodology for technology and failure analysis in manufacturing integrated circuits. Technology analysis is used to determine the way a component is built by observing it using adequate resolution, which increases progressively with the level of analysis.

Committee
TC 47/SC 47A
DevelopmentNote
Stability Date: 2017. (10/2012)
DocumentType
Technical Specification
Pages
23
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NEN NPR IEC/TS 61945 : 2000 Identical

13/30286159 DC : 0 BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
13/30286163 DC : 0 BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
13/30286167 DC : 0 BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
UTEC 96 029 : 2011 ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
I.S. EN 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
DD CLC/TS 50466:2006 Long duration storage of electronic components. Specification for implementation
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods

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