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  • IEC TS 62686-1:2015

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  31-12-2021

    Language(s):  English, Russian

    Published date:  22-04-2015

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Technical requirements
    Annex A (informative) - Test code (TC) information
    Annex B (informative) - Cross-reference to STACK Specification
            S/0001 revision 14
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC TS 62686-1:2015(E) defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition:
    - adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods;
    - update of JEDEC semiconductor test methods;
    - including addition of JEP148A, based on the Physics of Failure Risk and Opportunity assessment;
    - update of Annex A with additional JEDEC and IEC test information;
    - revision of lead-free termination finish requirements.

    General Product Information - (Show below) - (Hide below)

    Committee TC 107
    Development Note Supersedes IEC/PAS 62686-1. (09/2012) Stability Date: 2018. (10/2012)
    Document Type Technical Specification
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS PD IEC TS 62564-1 : 2016 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
    18/30373170 DC : 0 BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
    IEC 62933-1:2018 Electrical energy storage (EES) systems - Part 1: Vocabulary
    I.S. EN IEC 62933-1:2018 ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 1: VOCABULARY
    EN IEC 62933-1 : 2018 ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 1: VOCABULARY (IEC 62933-1:2018)
    IEC TS 62564-1:2016 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
    IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    BS PD IEC TS 62239-1 : 2015 PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    IEC TS 62933-5-1:2017 Electrical energy storage (EES) systems - Part 5-1: Safety considerations for grid-integrated EES systems - General specification
    BS PD IEC TS 62668-2 : 2016 PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
    EIA STD 4899 : 2017-05 REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN

    Standards Referencing This Book - (Show below) - (Hide below)

    J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-17:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 17: NEUTRON IRRADIATION
    IEC 60749-38:2008 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 38: SOFT ERROR TEST METHOD FOR SEMICONDUCTOR DEVICES WITH MEMORY
    IEC 60749-8:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING
    IEC 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
    MIL STD 883 : K TEST METHOD STANDARD - MICROCIRCUITS
    IEC 60749-25:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
    IEC 60749-30:2005+AMD1:2011 CSV SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    IEC 60749-5:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
    UL 94 : 6 TESTS FOR FLAMMABILITY OF PLASTIC MATERIALS FOR PARTS IN DEVICES AND APPLIANCES
    IEC 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    SAE J 1879 : 2014 HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS
    IEC 60749-29:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
    MIL PRF 19500 : P SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    IEC 62374:2007 SEMICONDUCTOR DEVICES - TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR GATE DIELECTRIC FILMS
    IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
    IEC 60749-36:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 36: ACCELERATION, STEADY STATE
    ISO/TS 16949:2009 Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations
    RTCA DO 254 : 2000 DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE
    MIL STD 750 : F TEST METHODS FOR SEMICONDUCTOR DEVICES
    IEC 60749-9:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    J STD 033 : C-1 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    ESDA/JEDEC JS-001 : 2017 ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
    EIA 556 : B1999 ELECTRONIC INDUSTRIES ASSOCIATION: OUTER SHIPPING CONTAINER BAR CODE LABEL STANDARD
    IEC 60749-33:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
    IEC TS 62564-1:2016 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
    IEC 60749-15:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    IEC 60749-7:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
    ISO 14001:2015 Environmental management systems Requirements with guidance for use
    J STD 035 : 0 ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
    IEC 62418:2010 Semiconductor devices - Metallization stress void test
    IEC 60749-34:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    IEC 60749-6:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE
    ISO 9001:2015 Quality management systems Requirements
    IEC 62416:2010 SEMICONDUCTOR DEVICES - HOT CARRIER TEST ON MOS TRANSISTORS
    MIL STD 1580 : B DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
    ESD S541 : 2008 PACKAGING MATERIALS FOR ESD SENSITIVE ITEMS
    IEC 60749-3:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
    IEC 62417:2010 SEMICONDUCTOR DEVICES - MOBILE ION TESTS FOR METAL-OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTORS (MOSFETS)
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60749-32:2002+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
    IEC 60749-14:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    IEC 60749-19:2003+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
    IEC 62415:2010 SEMICONDUCTOR DEVICES - CONSTANT CURRENT ELECTROMIGRATION TEST
    IEC 60749-22:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    IEC 60749-12:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 12: VIBRATION, VARIABLE FREQUENCY
    IEC 62374-1:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
    IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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