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IPC 4562 : A

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

METAL FOIL FOR PRINTED BOARD APPLICATIONS
Available format(s)

Hardcopy

Superseded date

12-04-2024

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
APPENDIX A - Copper Foil Application Guidelines

Covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in printed boards. Metal foils shall be considered acceptable, so long as the requirements in this specification are met, unless otherwise agreed between the supplier and the user.

DevelopmentNote
Supersedes IPC MF 150 and IPC CF 150. (12/2001) Included in IPC C 102, IPC C 107, IPC C 105 & IPC C 1000. (07/2008) Also available in Chinese Language, See IPC 4562 CHINESE. (07/2012) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
41
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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IPC A 600 POLISH : H ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 RUSSIAN : H ACCEPTABILITY OF PRINTED BOARDS
IPC 2222 CHINESE : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
IPC 4204 CHINESE : A2011 AMD 1 2013 FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC TR 484 : 1986 RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC A 600 FRENCH : H ACCEPTABILITY OF PRINTED BOARDS
IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
PPP-B-1672 Revision E:2013 BOXES, SHIPPING, REUSABLE WITH CUSHIONING
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 4204 : A FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
DSCC 11006 : 0 PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING
IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
DSCC 10012 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
I.S. EN 16602-70-12:2016 SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
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IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
ISO/IEC 17025:2005 General requirements for the competence of testing and calibration laboratories
IPC D 330 : 1992 DESIGN GUIDE MANUAL
IPC TM 650 : 0 TEST METHODS MANUAL
ANSI/NCSL Z540 1 : 94(R2002) CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS
IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
IPC TR 484 : 1986 RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
ISO 10012-1:1992 Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)

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