IPC 6013 : C
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Hardcopy
13-12-2021
English
1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 NOTES
APPENDIX A
Includes qualification and performance requirements of flexible printed boards.
Committee |
D-10
|
DevelopmentNote |
Supersedes IPC RF 245, IPC FC 250 & IPC ML 990. (07/2008) Supersedes IPC 6013 CHINESE & IPC 6013 GERMAN. (09/2017) Also available in Hardcopy format. (01/2018)
|
DocumentType |
Standard
|
Pages |
72
|
PublisherName |
Institute of Printed Circuits
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Standards | Relationship |
IEC PAS 62249:2001 | Identical |
IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
NASA STD 5005 : 2013 | STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
16/30282633 DC : 0 | BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4554 CHINESE : - | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC 6202 : 0 | IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS |
IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
IPC DR 572 : A | DRILLING GUIDELINES FOR PRINTED BOARDS |
IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC FLXCSP0605-CD : 2005 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC FLXCSP0706-CD : 2006 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING |
IPC SM 840 CHINESE : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC 4553 CHINESE : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
IPC 4556 : 0 | SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4554 : 0 | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
I.S. EN 61189-5-1:2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.