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IPC 7351 GERMAN : B

Current
Current

The latest, up-to-date edition.

Basic requirements for SMT design and SMD patch guideline
Published date

30-06-2010

Publisher

Institute of Printed Circuits

Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es, Angaben über die geeignete Grösse, Form und Toleranz der Anschlussflächen-Bilder für oberflächenmontierte Bauelemente an die Hand zu geben, um sicherzustellen, dass eine ausreichende Fläche zur Ausbildung von Lotmenisken zur Verfügung steht, die den Anforderungen der IPC J-STD-001 entspricht.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

IPC S 816 : 0 SMT PROCESS GUIDELINE AND CHECKLIST
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 2226 : 0 SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7530 : 0 GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 1902 : 1998 GRID SYSTEMS FOR PRINTED CIRCUITS
IPC 7525 : B STENCIL DESIGN GUIDELINES
IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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