IPC/JEDEC J-STD-033D:2018
Current
The latest, up-to-date edition.
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Hardcopy
English
01-03-2018
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
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