JEDEC JESD22-B118A:2021
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-11-2021
Publisher
Semiconductor wafer and die backside external visual inspection is an examination of the external nonactive surface area (hereafter called backside) of processed semiconductor wafers or die.
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