COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE

Amended by

MIL-DTL-47113 Revision E Notice 2 - Validation:2022

Available format(s)

PDF

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES

Specifies a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.

Committee	FSC 6850
DevelopmentNote	Supersedes MIL C 47113 (B). (08/2001) New child NOT 2 2022 is now added.
DocumentType	Standard
Pages	13
ProductNote	New child NOT 2 2022 is now added.
PublisherName	US Military Specs/Standards/Handbooks
Status	Current
Supersedes	MIL C 47113 : B

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