MIL-HDBK-251 Notice 1 - Validation:2021
Current
Current
The latest, up-to-date edition.
Reliability/Design Thermal Applications
Amendment of
Available format(s)
PDF
Language(s)
English
Published date
19-01-2021
Publisher
This handbook recommends and presents electronic parts stress analysis methods which lead to the selection of maximum safe temperatures for parts so that the ensuing thermal design is consistent with the required equipment reliability.
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