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MIL
MIL-PRF-31032-2 Revision C:2017

MIL-PRF-31032-2 Revision C:2017

Current

Current

The latest, up-to-date edition.

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING

Available format(s)

PDF

Language(s)

English

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES

Describes the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting.

Committee
FSC 5998
DocumentType
Standard
Pages
26
PublisherName
US Military Specs/Standards/Handbooks
Status
Current

MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL
MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
ASTM B 567 : 1998 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

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PDF - English
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