Customer Support: +44 (0)203 327 3140

Login to i2i Subscription Intertek.com
  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Go to AMERICAS site
Dismiss alert
Please enter a keyword to search
Advanced search

MIL-PRF-55681 Revision G:2016

Current
Current

The latest, up-to-date edition.

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Available format(s)

PDF

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - EQUIVALENT SERIES RESISTANCE MEASUREMENT CRITERIA
             FOR HIGH FREQUENCY CAPACITOR STYLES CDR11 THROUGH CDR14
             AND CDR21 THROUGH CDR25
APPENDIX B - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX C - VISUAL INSPECTION CRITERIA

Specifies the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors.

Committee
FSC 5910
DevelopmentNote
Supersedes MIL C 55681 (D) (07/2001)
DocumentType
Standard
Pages
91
PublisherName
US Military Specs/Standards/Handbooks
Status
Current
Supersedes

18/30373170 DC : 0 BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
MIL-STD-1580 Revision B:2003 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
MIL-PRF-55681-4 Revision H:2015 CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY)
DSCC 09027 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
DSCC 05007 : F CAPACITORS, FIXED, CERAMIC, CHIP, 1206
MIL-PRF-83531 Revision D:2014 DELAY LINES, PASSIVE, GENERAL SPECIFICATION FOR
DSCC 91019 : K CAPACITOR, FIXED, CERAMIC, CHIP, .56 [MU]F THROUGH 1 [MU]F
DSCC 14005 : 0 CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0508
DSCC 09023 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201
DSCC 88013 : G DELAY LINES, PASSIVE, 3-PIN, SIP
DSCC 06019 : B CAPACITOR, FIXED, CERAMIC, CHIP, HIGH FREQUENCY
DSCC 05006 : F CAPACITORS, FIXED, CERAMIC, CHIP, 0805
DSCC 03029 : E CAPACITOR, FIXED, CERAMIC, CHIP, 0402
DSCC 94006 : D CAPACITORS, FIXED, CERAMIC, CHIP
DSCC 05002 : G CAPACITOR, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
DSCC 05003 : E CAPACITOR, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP
DSCC 09026 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805
DSCC 05001 : F CAPACITOR, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
NASA MSFC STD 3012 : 2012 ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
DSCC 89089 : C CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE
DSCC 09025 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603
MIL-PRF-38535 Revision K:2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
DSCC 84035 : D DELAY LINES, PASSIVE, 10-TAP, DUAL-IN-LINE, 16-PIN
DSCC 09024 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
DSCC 06022 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY
IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
PD IEC/TS 62668-2:2016 Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources
MIL-HDBK-198 Revision B:2012 CAPACITORS, SELECTION AND USE OF
DSCC 03028 : E CAPACITORS, FIXED, CERAMIC, CHIP, 0603
DSCC 14004 : 0 CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0306

MIL-STD-202-211 Base Document:2015 METHOD 211, TERMINAL STRENGTH
MIL-STD-202-302 Base Document:2015 METHOD 302, INSULATION RESISTANCE
MIL-STD-202-210 Base Document:2015 METHOD 210, RESISTANCE TO SOLDERING HEAT
MIL-STD-202-305 Base Document:2015 METHOD 305, CAPACITANCE
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
MIL-STD-202-107 Base Document:2015 METHOD 107, THERMAL SHOCK
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
MIL-STD-202-106 Base Document:2015 METHOD 106, MOISTURE RESISTANCE
MIL-STD-202-301 Base Document:2015 METHOD 301, DIELECTRIC WITHSTANDING VOLTAGE
IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
MIL-STD-790 Revision G:2011 ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS
MIL-STD-202-104 Base Document:2015 METHOD 104, IMMERSION
MIL-STD-202-103 Base Document:2015 METHOD 103, HUMIDITY (STEADY STATE)
MIL-STD-202-108 Base Document:2015 METHOD 108, LIFE (AT ELEVATED AMBIENT TEMPERATURE)
MIL-STD-202-208 Base Document:2015 METHOD 208, SOLDERABILITY
MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
MIL-STD-690 Revision D:2005 Failure Rate (FR) Sampling Plans and Procedures

View more information
£16.70
Excluding VAT
GBP
CAD
CHF
CNY
DKK
EUR
GBP
HKD
IDR
INR
JPY
KRW
MXN
NOK
NZD
SEK
SGD
USD
ZAR
PDF - English
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

or

Get in touch with us