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MIL STD 750-2 : A

Current
Current

The latest, up-to-date edition.

MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
Available format(s)

PDF

Language(s)

English

Publisher

US Military Specs/Standards/Handbooks

FOREWORD
SUMMARY OF REVISION A, CHANGE 2 MODIFICATIONS
1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
CONCLUDING MATERIAL

Determines uniform test methods for the mechanical testing to determine resistance to deleterious effects of natural elements and conditions surrounding military operations.

Committee
FSC 5961
DocumentType
Standard
Pages
301
PublisherName
US Military Specs/Standards/Handbooks
Status
Current

MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
MIL-STD-750-1 Revision A:2015 Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999

MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
ISO 14644-2:2015 Cleanrooms and associated controlled environments Part 2: Monitoring to provide evidence of cleanroom performance related to air cleanliness by particle concentration
ANSI/NCSL Z540 3 : 2006(R2013) REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT
MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
MIL-STD-750-1 Revision A:2015 Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
MIL-STD-750-3 Base Document:2012 Transistor Electrical Test Methods for Semiconductor Devices Part 3: Test Methods 3000 Through 3999
FED-STD-595 Revision C:2008 COLORS USED IN GOVERNMENT PROCUREMENT
ASTM D 1867 : 2013 : REDLINE Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

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PDF - English
PDF - English
PDF - English
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