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NEN EN IEC 60749-16 : 2003

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
Published date

12-01-2013

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
IEC 60749-16:2003 Identical
EN 60749-16:2003 Identical

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