MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

Published date

12-01-2013

Publisher

Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack. Also specifies outlines and obtain interchangeability of G-QFP.

DevelopmentNote	Indice de Classement: C96-013-6-8 (09/2002)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
BS EN 60191-6-8:2001	Identical
DIN EN 60191-6-8:2002-05	Identical
I.S. EN 60191-6-8:2002	Identical
EN 60191-6-8:2001	Identical
UNE-EN 60191-6-8:2002	Identical
IEC 60191-6-8:2001	Identical

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NF EN 60191-6-8 : 2002

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

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Abstract

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