NF EN 60749-30 : 2005 AMD 1 2011

Superseded

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

Superseded date

01-11-2021

Published date

12-01-2013

Publisher

Association Francaise de Normalisation

1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
  4.1 Moisture chamber
  4.2 Solder equipment
  4.3 Optical microscope
  4.4 Electrical test equipment
  4.5 Drying (bake) oven
  4.6 Temperature cycle chamber (optional)
5 Procedure
  5.1 General
  5.2 Initial measurements
  5.3 Temperature cycling (optional)
  5.4 Drying (bake out)
  5.5 Soak conditions for dry-packed SMDs
  5.6 Method C for soak conditions for
       non-dry-packed SMDs in accordance with
       IEC 60749-20
  5.7 Solder reflow
  5.8 Flux application simulation (optional)
  5.9 Final measurements
  5.10 Applicable reliability tests
6 Summary
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications

Defines a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

DevelopmentNote	Indice de classement: C96-022-30 PR NF EN 60749-30 March 2004 (03/2004)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Superseded
SupersededBy	NF EN IEC 60749-30:2020

Standards	Relationship
DIN EN 60749-30:2011-12	Identical
IEC 60749-30:2005+AMD1:2011 CSV	Identical
NBN EN 60749-30 : 2006 AMD 1 2011	Identical
I.S. EN 60749-30:2005	Identical
UNE-EN 60749-30:2005	Identical
BS EN 60749-30 : 2005	Identical
EN 60749-30 : 2005 AMD 1 2011	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
NF EN 60749-11 : 2002	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD
IEC 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
NF EN 60749-5 : 2003	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-4:2017	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
NF EN 60749-4 : 2002	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
IEC 60749-11:2002	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC 60749-33:2004	Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
IEC 60749-24:2004	Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
NF EN 60749-33 : 2005	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
NF EN 60749-24 : 2005	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
NF EN 60749-20 : 2010	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
NF EN 60749-25 : 2003	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING