NF EN 60749-4 : 2002

Withdrawn

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)

Withdrawn date

29-09-2021

Published date

12-01-2013

Publisher

Association Francaise de Normalisation

Foreword
1 Scope
2 HAST test - General remarks
3 Test apparatus
4 Test conditions
5 Procedure
6 Failure criteria
7 Safety
8 Summary
Bibliography

Gives a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.

DevelopmentNote	Indice de classement: C96-022-4. (03/2003) Supersedes NF EN 60749. (06/2007)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Withdrawn
SupersededBy	NF EN 60749-4:2017

Standards	Relationship
UNE-EN 60749-4:2003	Identical
NBN EN 60749-4 : 2003	Identical
I.S. EN 60749-4:2017	Identical
BS EN 60749-4:2002	Identical
IEC 60749-4:2017	Identical
EN 60749-4:2017	Identical
DIN EN 60749-4:2016-06 (Draft)	Identical
BS EN 60749-4:2017	Identical

NF EN 60749-30 : 2005 AMD 1 2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
NF EN 60749-5 : 2003	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST