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SEMI P1 : 2008E

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR HARD SURFACE PHOTOMASK SUBSTRATES

Published date

12-01-2013

Covers the general requirements of glass substrate for hard surface photomasks.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001) Also available in CD-ROM. (06/2008) E = This standard was editorially modified to correct an error. (12/2009)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI P37 : 2013 SPECIFICATION FOR EXTREME ULTRAVIOLET LITHOGRAPHY SUBSTRATES AND BLANKS
SEMI D26 : 2000 PROVISIONAL SPECIFICATION FOR LARGE AREA MASKS FOR FLAT PANEL DISPLAYS (NORTH AMERICA)
SEMI P29 : 2011 SPECIFICATION FOR CHARACTERISTICS SPECIFIC TO ATTENUATED PHASE SHIFT MASKS AND MASKS BLANKS
SEMI P10 : 2012 SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS
SEMI D6 : 2011(R2017) SPECIFICATION FOR LIQUID CRYSTAL DISPLAY (LCD) MASK SUBSTRATES
SEMI P48 : 2010(R2016) SPECIFICATION OF FIDUCIAL MARKS FOR EUV MASK BLANK
SEMI P2 : 2008 SPECIFICATION FOR CHROME THIN FILMS FOR HARD SURFACE PHOTOMASKS
BS IEC 62899-301-1:2017 Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master external dimension
SEMI T11 : 2003(R2014) SPECIFICATION FOR MARKING OF HARD SURFACE RETICLE SUBSTRATES
SEMI P23 : 2000(R2007) GUIDELINE FOR PROGRAMMED DEFECT MASKS AND BENCHMARK PROCEDURES FOR SENSITIVITY ANALYSIS OF MASK DEFECT INSPECTION SYSTEMS
SEMI D38 : 2011 GUIDE FOR QUALITY AREA OF LCD MASKS
SEMI P3 : 2008 SPECIFICATION FOR PHOTORESIST/E-BEAM RESIST FOR HARD SURFACE PHOTOPLATES
IEC 62899-301-1:2017 Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension

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