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UNE-EN ISO 9453:2015

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
Available format(s)

Hardcopy , PDF

Superseded date

28-07-2021

Language(s)

Spanish, Castilian, English

Published date

22-04-2015

Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers
        in ISO 9453 and short names and chemical
        compositions according to IEC 61190-1-3
Bibliography

Describes the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; - tin-antimony; - tin-bismuth; - tin-copper, with and without silver; - tin-indium, with and without silver and bismuth; - tin-silver, with and without copper and bismuth; - tin-zinc, with and without bismuth.

Committee
CTN 14
DevelopmentNote
Supersedes UNE EN 29453. (03/2007)
DocumentType
Standard
Pages
20
PublisherName
Asociacion Espanola de Normalizacion
Status
Superseded
SupersededBy
Supersedes

ISO 3677:2016 Filler metal for soldering and brazing — Designation
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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£57.66
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