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ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
Institute of Printed Circuits
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
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