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    • IPC
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    IPC 6012 : B : AMD 2

    QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

    Institute of Printed Circuits

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    IPC A 610 : C : AMD 1

    ACCEPTABILITY OF ELECTRONIC ASSEMBLIES

    Institute of Printed Circuits

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    IPC 4101 : B : AMD 2

    SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS

    Institute of Printed Circuits

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    IPC 4204 : A : AMD 1

    FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY

    Institute of Printed Circuits

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    IPC 4203 : A : AMD 1

    COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY

    Institute of Printed Circuits

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    J STD 001 : D : AMD 1

    REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Institute of Printed Circuits

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    IPC A 600 : G : AMD 1

    ACCEPTABILITY OF PRINTED BOARDS

    Institute of Printed Circuits

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    J STD 002 : C : AMD 1

    SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES

    Institute of Printed Circuits

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    IPC 2222 : 0 : ERR 1

    SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

    Institute of Printed Circuits

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    IPC 4552 : 0 : AMD 1

    PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS

    Institute of Printed Circuits

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