Name: 05/30138794 DC : DRAFT SEP 2005
Brand: BSI

Superseded date

12-31-2007

Published date

11-23-2012

Publisher

British Standards Institution

Committee	EPL/501
DocumentType	Draft
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 62421:2007

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-27:2008	Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
ISO 3:1973	Preferred numbers Series of preferred numbers
IEC 60068-2-2:2007	Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-1:2007	Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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