1 Scope2 Object3 Terminology 3.1 Colophony 3.2 Contact angle 3.3 Wetting 3.4 Non-wetting 3.5 De-wetting 3.6 Solderability 3.7 Soldering time 3.8 Resistance to soldering heat4 Test Ta: Solderability of wire and tag terminations 4.1 Object 4.2 General description of the test 4.3 Specimen preparation 4.4 Initial measurements 4.5 Accelerated ageing 4.5.1 Ageing 1 4.5.2 Ageing 2 4.5.3 Ageing 3 4.6 Method 1: Solder bath at 235 degrees C 4.6.1 Description of solder bath 4.6.2 Flux 4.6.3 Procedure 4.6.4 Requirements 4.7 Method 2: Soldering iron at 350 degrees C 4.7.1 Description of soldering irons 4.7.2 Solder and flux 4.7.3 Procedure 4.7.4 Requirements 4.8 Method 3: Solder globule at 235 degrees C 4.8.1 Method 4.8.2 Conditions of test 4.8.3 Procedure 4.8.4 Requirements 4.9 De-wetting 4.9.1 Description of the solder bath 4.9.2 Procedure 4.9.3 Requirements 4.9.4 The above test shall then be repeated 4.10 Final measurements 4.11 Information to be given in the relevant specification5 Test Tb: Resistance of components to soldering heat 5.1 Object 5.2 General description of the test 5.3 Initial measurements 5.4 Method 1A: Solder bath at 260 degrees C 5.4.1 Solder bath 5.4.2 Flux 5.4.3 Procedure 5.5 Method 1B: Solder bath at 350 degrees C 5.5.1 Solder bath 5.5.2 Procedure 5.6 Method 2: Soldering iron at 350 degrees C 5.6.1 Description of soldering iron 5.6.2 Solder and flux 5.6.3 Procedure 5.7 Recovery 5.8 Final measurements 5.9 Information to be given in the relevant specification6 Test Tc: Solderability of printed boards and metal-clad laminates 6.1 Object 6.2 General description of the test 6.3 Specimen 6.4 Test apparatus 6.4.1 Solder bath 6.4.2 Conveyance of specimen 6.4.3 Specimen holder 6.4.4 Timing device 6.4.5 Solder cleaning 6.5 Solder 6.6 Flux 6.7 Accelerated ageing 6.8 Test procedure 6.8.1 General 6.8.2 Solderability - Time of contact with solder 6.9 Evaluation of solderability and de-wetting 6.10 Information to be given in the relevant specificationAnnex A - Example of apparatus for accelerated steam ageing processAnnex B - Specification for solderAnnex C - Specification for flux constituentsAnnex D - Specification for solder globule apparatusAnnex E - Specimen holder and timing needle arrangement