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ASTM F 1261M : 1996 : R2003

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Standard Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line [Metric] (Withdrawn 2009)
Available format(s)

Hardcopy , PDF

Withdrawn date

05-31-2009

Language(s)

English

Published date

06-10-1996

CONTAINED IN VOL. 10.04, 2009 Determines the average electrical width of a narrow thin-film metallization line. This is meant for measuring thin metallization lines such as are used in microelectronic circuits where the width of the lines can range from micrometers to tenths of micrometers.

1.1 This test method is designed for determining the average electrical width of a narrow thin-film metallization line.

1.2 This test method is intended for measuring thin metallization lines such as are used in microelectronic circuits where the width of the lines may range from micrometres to tenths of micrometres.

1.3 The test structure used in this test method may be measured while still part of a wafer, or part therefrom, or as part of a test chip bonded to a package and electrically accessible by means of package terminals.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Committee
F 01
DocumentType
Test Method
Pages
4
ProductNote
Reconfirmed 2003
PublisherName
American Society for Testing and Materials
Status
Withdrawn
Supersedes

ASTM F 1260 : 1989 Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations

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US$66.00
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