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ASTM F 1709 : 1997 : R2008

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

Available format(s)

Hardcopy , PDF

Superseded date

12-03-2023

Language(s)

English

Published date

06-15-2008

CONTAINED IN VOL. 10.04, 2016 Defines pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

Committee
F 01
DocumentType
Standard
Pages
3
ProductNote
Reconfirmed 2008
PublisherName
American Society for Testing and Materials
Status
Superseded
SupersededBy
Supersedes

ASTM F 3166 : 2016 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)

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US$66.00
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