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BS 123800-003:2001

Current

Current

The latest, up-to-date edition.

System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-17-2001

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Capability qualifying component
5 Range of capability approval
6 Capability test program
7 Additional test capability
8 Traceability
Annex A (normative) Use of ANSI/IPC A-600F
Bibliography

Describes the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible multilayer printed boards with through-connections.

This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible multilayer printed boards with through-connections. It is applicable for flexible multilayer printed boards with through-connections made with the materials and surface finishes specified in clause 4.

This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

Committee
EPL/501
DevelopmentNote
To be read in conjunction with BS 123000(2001) and BS 123800(2001). Supersedes 01/204167 DC. (01/2002)
DocumentType
Standard
Pages
26
PublisherName
British Standards Institution
Status
Current
Supersedes

BS 123800:2001 System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections

BS EN ISO 3543:2001 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
BS 123000:2001 System of quality assessment. Generic specification. Printed boards
BS EN 60249-2-13:1994 Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade
BS 123800:2001 System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
BS 6221-2:1991 Printed wiring boards Methods of test
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
BS EN 60249-2-15:1994 Specifications Flexible copper-clad polyimide film, of defined flammability
BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60249-2-15:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
BS EN ISO 1463:2004 Metallic and oxide coatings. Measurement of coating thickness. Microscopical method
BS 4727-1:GRP11(1991) : 1991 GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
IEC 60249-2-13:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections

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