BS CECC23400(1990) : 1990 AMD 7367

Name: BS CECC23400(1990) : 1990 AMD 7367
Brand: BSI

Superseded

View Superseded by

HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS

Superseded date

11-15-1992

Published date

12-06-2012

Publisher

British Standards Institution

Applies to flexible printed boards without through connections regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). BS AMD 7367 RENUMBERS THIS STANDARD TO BS EN 123400

Committee	ECL/19
DevelopmentNote	Renumbered and superseded by BS EN 123400. Supersedes 89/23561 DC. (08/2005)
DocumentType	Standard
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 123400:1992

Standards	Relationship
CECC 23400 : 1985	Identical

BS EN 123400-800:1992

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections

CECC 23000 : 1985	GENERIC SPECIFICATION: PRINTED BOARDS
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
CECC 00010 : 1980 AMD 1	BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
CECC 00111 : 80 AMD 3	CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY
IEC 60326-3:1991	Printed boards - Part 3: Design and use of printed boards