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BS EN 123200:1992

Current
Current

The latest, up-to-date edition.

Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

09-29-1989

Foreword
Preface
1. General
2. Capability qualifying component CQC
3. Capability approval
4. Capability testing
Characteristics test tables

Characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection.

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS CECC23200(1989). 1992 Version incorporates amendment 7361 to BS CECC23200(1989). Supersedes 86/31649 DC and 94/216046 DC. To be read in conjunction with BS CECC 23000(1989). (08/2005)
DocumentType
Standard
Pages
32
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
SN EN 123200 : AMD 1 1995 Identical
DIN EN 123200:1992-11 Identical
NEN EN 123200 : 1995 AMD 1 1995 Identical
EN 123200:1992/A1:1995 Identical
CECC 23200 : 1985 Identical
I.S. EN 123200:1994 Identical

BS CECC 23200-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

CECC 00107(PT3) : 80 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL
BS CECC23000(1989) : 1989 AMD 7145 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
CECC 00010 : 1980 AMD 1 BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS
BS 6221-2:1991 Printed wiring boards Methods of test
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
BS 6221-5:1982 Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes
CECC 00111 : 80 AMD 3 CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY
BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
BS 2011(1967) : LATEST

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