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BS EN 123300:1992

BS EN 123300:1992

Current

Current

The latest, up-to-date edition.

Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

08-31-1989

Publisher

British Standards Institution

Foreword
Preface
1. Introduction
1.1 Scope and object
1.2 Related documents
2. General
3. Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
4. Relevant specification
5. Characteristics of printed boards
      Table I
      Table II
6. Capability test programme
7. Quality conformance inspection
8. Test patterns
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Structure of test boards
8.4 Multiple arrangements of the CTP
Figure 2 - Composite test pattern
Figure 3 - Examples of soldered holes

Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection.

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS CECC23300(1989). 1992 Version incorporates amendment 7364 to BS CECC23300(1989). Supersedes 86/31650 DC and 94/216046 DC. (09/2005)
DocumentType
Standard
Pages
40
PublisherName
British Standards Institution
Status
Current
Supersedes

BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

CECC 00107(PT3) : 80 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL
BS CECC23000(1989) : 1989 AMD 7145 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
CECC 00010 : 1980 AMD 1 BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS
CECC 00107(PT2) : 79 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR ENHANCED ASSESSMENT OF QUALITY
BS 6221-2:1991 Printed wiring boards Methods of test
CECC 00107(PT1) : 1982 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - QUALITY ASSESSMENT PROCEDURE FOR GENERAL USAGE
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
CECC 00111 : 80 AMD 3 CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY
BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
BS 2011(1967) : LATEST

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