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BS EN 60068-2-54:2006

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Available format(s)

Hardcopy , PDF

Superseded date

07-31-2017

Language(s)

English

Published date

09-29-2006

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
   5.1 Test system
   5.2 Solder bath
6 Preconditioning
   6.1 Preparation of specimens
   6.2 Ageing
7 Materials
   7.1 Solder
   7.2 Flux
8 Procedure
   8.1 Test temperature
   8.2 Fluxing
   8.3 Flux drying
   8.4 Test
9 Presentation of results
   9.1 Form of chart-recorder trace
   9.2 Points of significance
   9.3 Reference wetting force
   9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
         for solderability testing
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Describes Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

Committee
EPL/501
DevelopmentNote
Supersedes BS 2011-2.1TA(1989) (09/2006)
DocumentType
Standard
Pages
22
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

DEFSTAN 61-12(PT12)SEC3/2(2008) : 2008 WIRES, CORDS AND CABLES - ELECTRICAL-METRIC UNITS - PART 12 SECTION 3: CABLES, TELEPHONE (FOR FIELD USE)

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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