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BS EN 60068-2-69:2017

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Available format(s)

Hardcopy , PDF

Withdrawn date

09-30-2019

Language(s)

English

Published date

05-09-2018

Publisher

British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method
5 Description of the test apparatus
6 Preparation of specimens
7 Materials
8 Procedure
9 Presentation of results
10 Information to be given in the relevant specification
Annex A (normative) - Equipment specification
Annex B (informative) - Use of the wetting balance for
        SMD solderability testing
Annex C (normative) - Test methods for SMD components
        sizes 0603M (0201) or smaller
Annex D (informative) - Evaluation criteria - Guidance
Annex E (informative) - Method of calculating the maximum
        theoretical force and integrated value of the area of the
        wetting curve for leaded non-SMD
Bibliography
Annex ZA (normative) - Normative references to
       international publications with their
       corresponding European publications

Defines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

This part of IEC60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Committee
EPL/501
DevelopmentNote
Supersedes 93/213653 DC. (09/2005) Supersedes 05/30139830 DC. (07/2007) Supersedes 14/30309696 DC & BS EN 60068-2-54. (07/2017)
DocumentType
Standard
Pages
60
PublisherName
British Standards Institution
Status
Withdrawn
SupersededBy
Supersedes

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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