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BS EN 60249-2-12:1994

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Specifications Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
Available format(s)

Hardcopy , PDF

Superseded date

08-15-2006

Language(s)

English

Published date

07-15-2001

Publisher

British Standards Institution

Committees responsible
National foreword
Foreword
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material
   after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
         quoted in this standard with the references of
         the relevant European publications

Provides requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. These laminated sheets have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). Materials may be used for single sided or double sided printed boards.

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS 4584-102.12(1990). 1994 version incorporates amendment 8418 to BS 4584-102.12(1990). Supersedes BS 4584-12(1977), 89/22207 DC, 97/206325 DC & 98/232111 DC. Also numbered as IEC 60249-2-12. (09/2005)
DocumentType
Standard
Pages
14
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards

IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

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Hardcopy - English
PDF - English
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