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BS EN 60749-15:2010

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices

Available format(s)

Hardcopy , PDF

Superseded date

10-01-2020

Language(s)

English

Published date

06-30-2011

Foreword
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography

Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

Committee
EPL/47
DevelopmentNote
Supersedes 00/203279 DC (07/2003) Supersedes BS EN 60749. (09/2005) Supersedes 09/30203267 DC. (02/2011)
DocumentType
Standard
Pages
10
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

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US$143.74
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