Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-15-1997

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative reference
3 Basic requirements
    3.1 Design
    3.2 Rigid board manufacturer
    3.3 Assembly
    3.4 Use
4 Deviations from flatness - rigid copper-clad
    base material
    4.1 Causes
    4.2 Prevention and correction
    4.3 Test methods and requirements
5 Deviations from flatness - unassembled rigid
    printed boards
    5.1 Causes
    5.2 Prevention
    5.3 Ratification
    5.4 Requirements for flatness
    5.5 Measurement methods
6 Deviations from flatness - rigid printed board
    assemblies
    6.1 Causes
    6.2 Prevention
    6.3 Correction
7 Problems associated with placement of surface-mounted
    components
    7.1 Placement of components (assembly)
    7.2 Requirements for "pick-and-place" machines
8 Deviations from flatness in service
9 Prevention summary
10 Corrective action summary
Annex ZA (normative) Normative references to international
publications with their corresponding European publications

Covers factors controlling the flatness of rigid printed boards with their assemblies in order to advise the designer, manufacturer, assembler and user of rigid printed boards and assemblies of issues affecting flatness. Includes advice with regard to design, base material, unassembled printed board and printed board assemblies.

Committee	EPL/501
DevelopmentNote	Supersedes BS 6221-23(1991) (03/2001) Also numbered as IEC 61188-1-1 Supersedes 96/206958 DC (11/2005)
DocumentType	Standard
Pages	14
PublisherName	British Standards Institution
Status	Current
Supersedes	96/206958 DC : JUN 96 BS 6221-23:1991

Standards	Relationship
DIN EN 61188-1-1:1998-03	Identical
EN 61188-1-1:1997	Identical
I.S. EN 61188-1-1:1999	Identical
SN EN 61188-1-1 : 1997	Identical

IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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BS EN 61188-1-1:1997

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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