Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

06-15-1999

Publisher

British Standards Institution

Committee	EPL/501
DevelopmentNote	Also numbered as IEC 61249-2-12 Supersedes 95/208512 DC (08/2004)
DocumentType	Standard
Pages	20
PublisherName	British Standards Institution
Status	Current
Supersedes	95/208512 DC : JUL 95

BS 6221-21:2001

Printed wiring boards Guide to the rework of unassembled boards

EN 61249-5-1:1996	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-1:1997+AMD1:2001 CSV	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
IEC 61249-5-1:1995	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures