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BS EN 62326-4:1997

Current
Current

The latest, up-to-date edition.

Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

06-15-1997

Publisher

British Standards Institution

1 Scope
2 Normative references
3 General
4 Capability approval and maintenance of capability
    approval
5 Test specimens
6 Test sequences
7 Quality assessment
8 Customer Detail Specification (CDS) data
9 Characteristics of printed boards
10 Capability test programme
11 Quality conformance inspection
12 Test specimens
Figures
1 Resin smear at interface
2 Circumferential defects
3 Conductor pattern defects
4 Minimum annular width (W1) of external land
5 Minimum annular width (W2) of internal land
6 Hole break-out
7 Examples of soldered holes
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA Normative references to international publications with
    their corresponding European publications

Applies to rigid multilayer printed boards whatever the method of manufacture and forms the basis for agreements between manufacturer and user.

Committee
EPL/501
DevelopmentNote
Also numbered as IEC 62326-4 and QC 230500. (09/2005)
DocumentType
Standard
Pages
38
PublisherName
British Standards Institution
Status
Current

Standards Relationship
EN 62326-4:1997 Identical
I.S. EN 62326-4:1998 Identical
SN EN 62326-4 : 1997 Identical
UNE-EN 62326-4:1999 Identical
DIN EN 62326-4:1997-08 Identical
NBN EN 62326-4 : 1997 Identical
NF EN 62326-4 : 1998 Identical

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61249-2-11:2003 Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
HD 323.2.3 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61249-2-9:2003 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
EN 62326-1:2002 Printed boards - Part 1: Generic specification
IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
HD 323.2.38 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST

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