BS EN 62878-1-1:2015
Current
Current
The latest, up-to-date edition.
Device embedded substrate Generic specification. Test methods
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
07-31-2015
Publisher
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test methods
5 Shipping inspection
Annex A (informative) - Related test methods
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the test methods of passive and active device embedded substrates.
IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| EN 62878-1-1:2015 | Identical |
| IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
| EN ISO 15184:2012 | Paints and varnishes - Determination of film hardness by pencil test (ISO 15184:2012) |
| IEC 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| IEC 62421:2007 | Electronics assembly technology - Electronic modules |
| IEC TS 62878-2-1:2015 | Device embedded substrate - Part 2-1: Guidelines - General description of technology |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN ISO 9445-1:2010 | Continuously cold-rolled stainless steel - Tolerances on dimensions and form - Part 1: Narrow strip and cut lengths (ISO 9445-1:2009) |
| EN 60068-2-64:2008 | ENVIRONMENTAL TESTING - PART 2-64: TESTS - TEST FH: VIBRATION, BROADBAND RANDOM AND GUIDANCE |
| EN ISO 2409:2013 | Paints and varnishes - Cross-cut test (ISO 2409:2013) |
| ISO 3366:1999 | Coated abrasives Abrasive rolls |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| ISO 4957:1999 | Tool steels |
| EN 61189-11 : 2013 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
| IEC 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| ISO 15184:2012 | Paints and varnishes Determination of film hardness by pencil test |
| EN ISO 4957:1999 | Tool steels (ISO 4957:1999) |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 6906:1984 | Vernier callipers reading to 0,02 mm |
| ISO 29864:2007 | Self adhesive tapes Measurement of breaking strength and elongation at break |
| ISO 9180:1988 | Black leads for wood-cased pencils Classification and diameters |
| EN ISO 9453:2014 | Soft solder alloys - Chemical compositions and forms (ISO 9453:2014) |
| EN 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| ISO 6353-3:1987 | Reagents for chemical analysis — Part 3: Specifications — Second series |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 29863:2007 | Self adhesive tapes Measurement of static shear adhesion |
| IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| ISO 29862:2007 | Self adhesive tapes Determination of peel adhesion properties |
| ISO 3599:1976 | Vernier callipers reading to 0,1 and 0,05 mm |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 8512-1:1990 | Surface plates — Part 1: Cast iron |
| ISO 291:2008 | Plastics Standard atmospheres for conditioning and testing |
| EN ISO 3611:2010 | Geometrical product specifications (GPS) - Dimensional measuring equipment: Micrometers for external measurements - Design and metrological characteristics (ISO 3611:2010) |
| IEC 60068-2-80:2005 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
| ISO 3611:2010 | Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| EN ISO 291:2008 | Plastics - Standard atmospheres for conditioning and testing (ISO 291:2008) |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| EN 61189-1 : 97 AMD 1 2001 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
| EN 62137-1-3:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| ISO 8512-2:1990 | Surface plates — Part 2: Granite |
| EN 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| EN 60068-2-66:1994 | Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| ISO 21948:2001 | Coated abrasives Plain sheets |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
| ISO 2409:2013 | Paints and varnishes Cross-cut test |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| ISO 9445-1:2009 | Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance: Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 62421:2007 | Electronics assembly technology - Electronic modules |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
| EN 60068-2-80:2005 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
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