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PD IEC/TS 62878-2-4:2015

Current

Current

The latest, up-to-date edition.

Device embedded substrate Guidelines. Test element groups (TEG)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

04-30-2015

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test conditions and sample preparation
5 TEG
Bibliography

Defines the test element group devices useful when measuring basic properties of device embedded substrates.

This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded substrates.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

Committee
EPL/501
DocumentType
Standard
Pages
40
PublisherName
British Standards Institution
Status
Current

Standards Relationship
IEC TS 62878-2-4:2015 Identical

IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions

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