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BS QC 763000(1990) : AMD 6754

Current
Current

The latest, up-to-date edition.

HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION
Published date

11-23-2012

National foreword
Committees responsible
Section 1 - Scope, object and classification
1.1 Scope
1.2 Object
1.3 Technological classification of F and HFICs
Section 2 - General
2.1 Order of precedence
2.2 Related documents
2.3 Units and symbols
2.4 Terminology
2.5 Standard and preferred values
2.6 Marking
Section 3 - Quality assessment procedures
3.1 Primary stage of manufacture
3.2 Manufacturing stages and sub-contracting
3.3 Manufacturer approval
3.4 Approval of film integrated circuits and hybrid
      film integrated circuits
3.5 Qualification approval
3.6 Capability approval
3.7 Certified records of released lots
3.8 Delayed deliveries
3.9 Delivery of F and HFICs subjected to destructive
      or non-destructive tests
3.10 Supplementary procedure for deliveries
3.11 Supplementary information
Section 4 - Test and measurement procedures
4.1 General
4.2 Standard conditions for testing
4.3 Visual examination
4.4 Electrical measurement procedures
4.5 Environmental testing procedures

This generic specification is applicable to film integrated circuits and to hybrid film integrated circuits, both passive and active, as in IEC Publication 748-1, Chapter IV, Sub-clause 2.4. Applies to partly-completed F and HFICs supplied to customers for subsequent processing. Also applies to chip carrier circuits having more than one chip, provided that they, as separate products, have been interconnected by film interconnection techniques. Not intended to cover printed circuit boards but is applicable to F and HFICs which may include them.

Committee
ECL/24
DocumentType
Standard
PublisherName
British Standards Institution
Status
Current

BS QC 390000:1992 Harmonized system of quality assessment for electronic components. Fixed film resistor networks for use in electronic equipment. Generic specification

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IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
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IEC 60068-3-1:2011 Environmental testing - Part 3-1: Supporting documentation and guidance - Cold and dry heat tests
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 60191-3A:1976 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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