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CEI CECC 200025 : 2000

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
Available format(s)

Hardcopy , PDF

Withdrawn date

07-01-2020

Language(s)

English

Published date

01-01-2000

Publisher

Comitato Elettrotecnico Italiano

Introduction
1 General requirements
2 Quality requirements of the process sequence
3 Specialist Assembly Facility documentation requirements
4 Audits
5 Corrective actions and failure analysis
6 Interface between Assembly Facility and Customer
7 Training
8 Notification of modifications to capability
Annexes
Annex A - Definitions
Annex B - Form and content of process specifications
Annex C - Form and content of Process Manuals
Annex D - Format of first page of Process Approval report
Annex E - Example abstract of description of Process Approval
Annex F - Audit check list (technical)
Annex G - Abbreviations

Defines the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the operation of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assessed quality.

Committee
CT 309
DevelopmentNote
Classificazione CEI 91-1 (01/2003)
DocumentType
Standard
Pages
42
PublisherName
Comitato Elettrotecnico Italiano
Status
Withdrawn

Standards Relationship
CECC 200025 : 1998 Identical

IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
CECC 00114-5 : 94 AMD 2 PROCESS APPROVAL OF SPECIALIST CONTRACTORS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY
EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
CECC 00200 : 2002 REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
CECC 200 012 : 1995 PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD DESIGNED FACILITIES
CECC 00401 : 91 AMD 1 GLOSSARY OF ABBREVIATIONS, TERMS AND DEFINITIONS OF THE CECC SYSTEM
EN ISO 9000:2015 Quality management systems - Fundamentals and vocabulary (ISO 9000:2015)
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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PDF - English
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