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CEI EN 60068-2-83 : 2012

Current

Current

The latest, up-to-date edition.

ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

FOREWORD
INTRODUCTION
1. Scope
2. Normative references
3. Terms and definitions
4. Test
5. Preconditioning
6. Preparation
7. Quick heating method
8. Synchronous method
9. Temperature profile method
Annex A (normative) - Equipment for the quick
                      heating and synchronous method
Annex B (informative) - Reading of the output
                        data and correction of the result
                        in the quick heating test
Annex C (normative) - Test equipment for the
                      temperature profile method
Annex D (informative) - Reading of the output
                        data and correction of the result
                        in the temperature profile test
Annex E (informative) - Caveats/Notes
Bibliography
Annex ZA (normative) - Normative references
                       to international publications
                       with their corresponding
                       European publications

Describes the methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.

Committee
CT 309
DevelopmentNote
Classificazione CEI 104-46. (11/2012)
DocumentType
Standard
Pages
44
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 60068-2-83 : 2011 Identical
IEC 60068-2-83:2011 Identical

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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