Name: CEI EN 60068-3-13 : 1ED 2017
Brand: CEI

ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING

Published date

03-13-2017

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Overview
5 Component soldering - Processes
6 Soldering tests
7 Soldering tests - Methods
8 Requirements and statistical character of results
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications

Specifies background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components.

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-86. Supersedes CEI EN 60068-2-44 which remains current and will be withdrawn on 17-06-2019. (03/2017)
DocumentType	Standard
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60068-2-44 : 1996

Standards	Relationship
IEC 60068-3-13:2016	Identical
EN 60068-3-13:2016	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 62137-3:2011	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
EN 62137-3:2012	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-83:2011	Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 60068-2-83 : 2011	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method